HPE
HPE P00922-B21, 16GB (1x16GB) Dual Rank x8 DDR4-2933 CAS-21-21-21 Registered Smart Memory Kit
MPN:
P00922-B21
SKU:
CMPLA23018
DRAM
Specifications
Capacity
16 GB
Memory Speed
2933 MHz
Form Factor
DIMM 288-pin
Storage Capacity
16 GB
Speed
2933 MHz (PC4-23400)
Compliant Standards
PC4-23400
Quantity
1
Technology
DDR4 SDRAM
Upgrade Type
System specific
Product Type
DRAM
Model Number
HPE P00922-B21
Data Integrity Check
ECC
Brand
HPE
Input Voltage
1.2 V
Country of origin
China
RAM
Registered
Manufacturer
HP
Memory Type
DDR4 SDRAM - DIMM 288-pin
Features
Dual rank, registered
Designed For
Nimble Storage dHCI Large Solution with HPE ProLiant DL380 Gen10; ProLiant BL460c Gen10, DL180 Gen10, DL360 Gen10, DL380 Gen10, DL388 Gen10, DL560 Gen10, DL580 Gen10, DX170r Gen10, DX360 Gen10, DX380 Gen10, DX560 Gen10, ML350 Gen10
Description
FAQs:
Q: Is this memory kit compatible with non-HPE servers?
A: While designed for HPE servers and systems, this memory kit may also be compatible with select third-party servers that support DDR4 memory modules. However, compatibility and performance may vary, so it's recommended to consult the server's specifications before purchase.
Q: Does this memory kit support ECC (Error-Correcting Code)?
A: Yes, this memory kit supports ECC technology, providing advanced error detection and correction capabilities to prevent data corruption and ensure system stability and reliability.
Q: Can this memory kit be used for virtualization environments?
A: Absolutely, this memory kit is well-suited for virtualization environments, offering high capacity, speed, and reliability to support virtualized workloads and applications effectively.
Q: What is the warranty coverage for this memory kit?
A: The warranty coverage for this memory kit may vary depending on the manufacturer's policies. Typically, HPE memory products come with a limited warranty that covers defects in materials and workmanship.
Q: Can this memory kit be upgraded in the future?
A: Yes, this memory kit can be upgraded in the future by adding additional modules or replacing existing modules with higher-capacity ones, providing flexibility and scalability for future expansion.